Sapphire abrasive YG-D302
- Product introduction: Sapphire substrate CMP polishing solution is a new generation of water-soluble high-purity CMP slurry produced by our company. It has the characteristics of good stability, high concentration, recyclable use, etc. It is used in the s...
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Product details
Product introduction: Sapphire substrate CMP polishing solution is a new generation of water-soluble high-purity CMP slurry produced by our company. It has the characteristics of good stability, high concentration, recyclable use, etc. It is used in the soft polishing process of sapphire substrate and can achieve chip mobility
High, high surface flatness, low roughness, no micro defects such as pits and corrosion pits on the surface, and many parameters have reached the international advanced level. YG-D302 CMP slurry is a gel with better density prepared by the hydrolysis process of simple silicon and improved in auxiliary catalysis, which has the advantages of high removal rate and good surface quality.
Product parameters:
Appearance: milky white
PH value: 10-12
Specific gravity: 1.265-1.300
Viscosity (mPa. s, 25 * C)<5
Particle size (nm): 120-140
Si02% :38-42
Product features: less impurities, easy to clean, non-toxic and pollution-free.
Product application: This product is mainly applicable to the high-quality leveling and finishing process of 2, 4 and 6 inch sapphire substrates.
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